Physics

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    3D Imprint Lithography Using Sixny Molds
    (2002) Jayatissa, N.W.K.; Alkaisi, M.M.; Blaikie, R.J.
    Three-dimensional patterning reduces more complicated alignment steps in the fabrication of micro and nano-scale structures. Multiple lithography processes with interlevel alignment or single lithography with multi layer resist is essential for three dimensional patterning. A number of 3D structures have found immediate applications in a range of microelectronic systems such. as micro-optics, micro-electromechanical systems, and in monolithic microwave integrated circuits. We have previously demonstrated that imprint at low temperatures (well below the glass transition of the resist) is possible for a number of structures using silicon nitride (SixNy) molds. A low temperature process is important for pattering substrates or polymer-based materials that are intolerant of high temperatures. The advantages of using SixNy for mold making are the capability of forming reliable nanoscale structures and its surface properties that allows imprint without sticking. In this work we will present pattering results for three-dimensional structures using nanoimprint lithography with SixNy molds. The mold material consists of a 1?m thick low stress SixNy layer deposited by low-pressure chemical vapour deposition (LPCVD) on to a silicon substrate. Patterning of the SixNy was performed using electron beam lithography at 50keV into ma-N 24033 negative tone resist.
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    Multilevel nanoimprint lithography
    (Current Applied Physics, 2004) Alkaisi, M.M.; Jayatissa, N.W.K.; Konijn, M.
    Multilevel and three-dimensional (3D) patterning eliminates more complicated steps in the fabrication processes of micro and nanoscale structures. Multiple lithography processes with inter-level alignment or single lithography with multi layer resist is essential for three-dimensional patterning. Nanoimprint lithography has demonstrated the potential of 3D patterning in a single step. A number of 3D structures have found immediate applications in a range of microelectronic systems such as microoptics, microelectromechanical systems, and monolithic microwave integrated circuits [Appl. Phys. Lett. 78 (2000) 3322; Appl. Phys. Lett. 79 (2001) 2285]. In this work, electron beam lithography (EBL) with different doses followed by reactive ion etching (RIE) is employed in the fabrication of multilevel structures of SixNy molds. The multi level patterns have been transferred into the mold in single step RIE. The imprint process has been performed below the glass transition temperature of the polymer. This may alleviate the alignment errors due to different thermal expansion coefficients in various materials.